The Union Cabinet has approved four new semiconductor projects worth ₹4,594 crore. Stating this at a press conference in New Delhi on Tuesday, Union Minister for Railways, Information and Broadcasting, and Electronics and Information Technology Ashwini Vaishnav said the approved projects include two in Odisha, one in Punjab and one in Andhra Pradesh.
“Semiconductors are a foundational, strategic industry without which no country can count itself among developed nations. The six projects that were previously approved have a capacity of producing 24 billion chips annually,” said Vaishnaw.
The minister said the Bhabaneswar plant would manufacture silicon carbide. “It’s an advanced plant where there will be advanced research. IIT Bhubaneswar has a well-established research unit which will assist in research work. To grow silicon carbide, the powder is vapourised at 2,400 degrees and accreted on a crystal. A wafer is then made. This is precision work, and this plant will do that work,” he said.
Talking about the 3D glass factory in Odisha, Vaishnaw said, “In this unit, Intel has an investment. Some of the world’s big companies will invest in it soon, which include Lockheed Martin and many private equity and venture capital funds. This 3D glass technology will be used across various industries like defence.” Vaishnaw said 3D glass would be used in aerospace, defence, radar, wireless and high power computing racks.
Continental Device India Pvt Ltd (CDIL) will work with a Korean firm to make specific devices like MOSFETs in Punjab, he said, adding that the fourth plant will be set up by Advanced System in Package Technologies Pvt Ltd (ASIP) in Andhra Pradesh.
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