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PM Modi lays foundation stone for ₹27,000 crore semiconductor facility in Assam

The event, organised at the site of the facility in Jagiroad, witnessed the presence of Chief Minister Himanta Biswa Sarma, who hailed the occasion as a landmark day for Assam and the North East.

- Guwahati - UPDATED: March 13, 2024, 05:29 PM - 2 min read

Prime Minister Narendra Modi.

PM Modi lays foundation stone for ₹27,000 crore semiconductor facility in Assam

Prime Minister Narendra Modi. File Photo.


Prime Minister Narendra Modi virtually inaugurated the foundation stone laying ceremony for a ₹27,000-crore semiconductor assembly and test facility in Assam's Morigaon district today. 

 

The event, organised at the site of the facility in Jagiroad, witnessed the presence of Chief Minister Himanta Biswa Sarma, who hailed the occasion as a landmark day for Assam and the North East.

 

"Hon'ble Prime Minister Shri Narendra Modi Ji is laying the foundation stone for the ₹27,000 crore Tata Semiconductor Assembly and Test facility at Jagiroad," tweeted the chief minister, expressing his enthusiasm for the transformative project.

 

Quoting the Prime Minister, Sarma underscored the historical significance of the event, stating, "Today we are also creating history and taking a strong step towards a bright future."

 

He emphasised the anticipation among the people for this "game-changing project," which promises to usher in a new era of development for Assam and the North East.

 

Highlighting the rapid progress of the project, Sarma lauded the swift transition from conception to implementation, attributing it as yet another testament to the boundless opportunities offered by effective governance.

 

The greenfield project by Tata Electronics at Jagiroad is poised to revolutionize the region's economic landscape, with an investment of ₹27,000 crore and the creation of employment opportunities for over 30,000 individuals. The first phase of the facility is slated to commence operations by mid-2025.

 

Sarma reiterated the government's commitment to transforming Assam and the North East into hubs of significant investment and development.

 

The facility will focus on three primary platform technologies - wire bond, flip chip, and integrated systems packaging (ISP), with plans to expand into advanced packaging technologies in the future. 

 

 

Semiconductor assembly and testing play a pivotal role in the value chain, ensuring the quality and functionality of semiconductor products.

 

The proposed facility aims to cater to the burgeoning global demand across various market segments, including artificial intelligence, industrial, and consumer electronics, thereby fostering industrialization in North-East India. 

 

It aligns with the Centre's semiconductor policy, driven by the India Semiconductor Mission, and the Assam government's electronics policy.

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